Spansion Inc. Contracts

Sample Business Contracts from Spansion Inc.

Accounts Receivables Trust Agreement - FASL Japan Ltd. and Mizuho Trust & Banking Co. Ltd. (Mar 25, 2004)
Agency Agreement - Spansion LLC and Advanced Micro Devices Inc. (Dec 7, 2005)
Agency Agreement - Spansion LLC and Advanced Micro Devices Inc. (Apr 1, 2005)
Agreement and Plan of Merger and Reorganization - Spansion Inc. and Saifun Semiconductors Ltd. (Oct 7, 2007)
Asset Purchase Agreement - Spansion Japan Ltd. and Fujitsu Ltd. (Sep 28, 2006)
Bank Enterprise Cooperation Agreement - Spansion (China) Co. Ltd. and Agricultural Bank of China (Dec 1, 2005)
Bank Enterprise Cooperation Agreement - Spansion (China) Co. Ltd. and Gusu Sub-branch, Agricultural Bank of China (Dec 1, 2005)
Change of Control Severance Agreement - Spansion Inc.
Continuing Guaranty - Spansion Inc. and Bank of America NA (Dec 21, 2005)
Credit Agreement - Bank of America NA and Spansion LLC (Sep 19, 2005)
Credit Agreement - Spansion LLC, Spansion Inc. and Bank of America NA (Nov 1, 2006)
Deed of Trust, Security Agreement, Assignment of Rents and Financing Statement - Spansion Inc., PRLAP Inc., and Bank of America NA (Sep 13, 2005)
Distribution Agreement - FASL LLC and Advanced Micro Devices Inc. (Jun 30, 2003)
Distribution Agreement - Spansion Inc. and Fujitsu Ltd. (2005)
Distribution Agreement [Amendment No. 2] - Spansion Inc. and Fujitsu Ltd. (Sep 26, 2008)
Floating Pledge Agreement - Mizuho Corporate Bank Ltd. and Spansion Japan Ltd. (Mar 25, 2005)
Foundry Agreement - Fujitsu Ltd., Spansion Japan Ltd., Spansion Inc., Spansion Technology Inc. and Spansion LLC (Sep 28, 2006)
Foundry Agreement - Semiconductor Manufacturing Inernational Corp. and Spansion LLC (Aug 31, 2007)
Foundry Agreement - Spansion Japan Ltd. and Fujitsu Ltd. (Mar 31, 2005)
Foundry Agreement [Amendment No. 1] - Spansion Japan Ltd. and Fujitsu Ltd. (Sep 28, 2006)
Foundry Agreement [Amendment No. 1] - Spansion LLC and Semiconductor Manufacturing International Corp. (Aug 12, 2008)
General Administrative Services Agreement - Spansion Inc. and Advanced Micro Devices Inc. (2005)
General Administrative Services Agreement - Spansion Inc. and Fujitsu Ltd. (2005)
Guaranty Agreement - Spansion Inc., Spansion Technology Inc., Spansion International Inc., Cerium Laboratories LLC and Bank of America NA (Nov 3, 2006)
Information Technology Services Agreement - Spansion Inc. and Advanced Micro Devices Inc. (2005)
Information Technology Services Agreement - Spansion Inc. and Fujitsu Ltd. (2005)
Intellectual Property Contribution and Ancillary Matters Agreement - Fujitsu Ltd., Advanced Micro Devices Inc., AMD Investments Inc., Spansion Inc. and Spansion Technology Inc. (2005)
Joinder Agreement - Spansion Inc. and Bank of America NA (Dec 21, 2005)
Manufacturing Services Agreement - FASL LLC and Fujitsu Ltd. (Jun 30, 2003)
Manufacturing Services Agreement [Amendment No. 1] - Spansion LLC and Fujitsu Ltd. (2005)
Master Lease Agreement - Spansion Japan Ltd. and Fujitsu Ltd. (Sep 28, 2006)
Master Lease Agreement for Semiconductor Manufacturing Equipment - SumiCrest Leasing Ltd. and Spansion Japan Ltd. (Jan 5, 2005)
Master Purchase Agreement for Semiconductor Manufacturing Equipment - Spansion Japan Ltd. and SumiCrest Leasing Ltd. (Jan 5, 2005)
Master Rental Agreement - GE Capital Leasing KK and FASL Japan Ltd. (Jul 16, 2003)
Master Rental Agreement - Spansion LLC and Macquarie Electronics USA Inc. (Mar 26, 2008)
Master Semiconductor Foundry and Technology Transfer Agreement - Spansion LLC and Taiwan Semiconductor Manufacturing Co. Ltd. (Aug 10, 2005)
Memorandum of Understanding - Spansion Inc. and Fujitsu Ltd. (Mar 31, 2007)
Non-Competition Agreement - Advanced Micro Devices Inc., AMD Investments Inc., Fujitsu Ltd. and Spansion Inc. (2005)
Noncompetition and Retention Agreement - Saifun Semiconductors Ltd., Spansion Inc. and Boaz Eitan (Oct 7, 2007)
Offer Letter - Spansion Inc. and Bertrand Cambou (Apr 6, 2005)
Offer Letter - Spansion Inc. and Jose A. Mejia (Jun 14, 2006)
Offer Letter - Spansion LLC and Dario Sacomani (Feb 9, 2006)
Offer Letter - Spansion LLC and Richard Previte (Jan 3, 2005)
Offer Letter - Spansion LLC and Robert C. Melendres (Dec 17, 2004)
Offer Letter - Spansion LLC and Tom Eby (Sep 15, 2005)
Patent Cross-License Agreement - Advanced Micro Devices Inc. and Spansion Inc. (2005)
Patent Cross-License Agreement - Fujitsu Ltd. and Spansion Inc. (2005)
Pledge and Security Agreement - Spansion Inc., Spansion LLC, Spansion Technology Inc., Spansion International Inc., Cerium Laboratories LLC and Bank of America NA (Nov 3, 2006)
Promissory Note - FASL LLC and Advanced Micro Devices Inc. (Jun 30, 2003)
Promissory Note - FASL LLC and Advanced Micro Devices Inc. (Jun 30, 2003)
Promissory Note - FASL LLC and Fujitsu Microelectronics Holding Inc. (Jun 30, 2003)
Remediation Agreement - Advanced Micro Devices Inc., Fujitsu Ltd. and FASL LLC (Jun 30, 2003)
Revolving Line Agreement - Spansion Japan Ltd., Mizuho Corporate Bank Ltd., Shinkin Central Bank, Bank of Yokohama Ltd. and Norinchukin Bank (Mar 25, 2005)
Secondment and Transfer Agreement - Spansion Japan Ltd. and Fujitsu Ltd. (Sep 28, 2006)
Security Agreement - GE Capital Leasing Corp. and Spansion Japan Ltd. (Mar 30, 2007)
Security Agreement - Spansion Japan Ltd. and GE Capital Leasing Corp. (Mar 30, 2007)
Security Agreement - Spansion LLC and Bank of America NA (Sep 19, 2005)
Senior Facility Agreement - Spansion Japan Ltd., GE Capital Leasing Corp., Sumisho Lease Co. Ltd., Mitsui Leasing & Development Ltd. and Resona Bank Ltd. (Mar 30, 2007)
Settlement Agreement - Spansion Inc. and Fujitsu Ltd. (Aug 20, 2008)
Stock Pledge - Bank of America NA and Spansion LLC (Sep 19, 2005)
Supplemental Secondment and Transfer Agreement - Spansion Japan Ltd. and Fujitsu Ltd. (Jul 1, 2005)
Temporary Living Expenses and Relocation Expenses Agreement - Spansion LLC and Dario Sacomani (Jan 1, 2008)
Term Loan Agreement - General Electric Capital Corp. and FASL LLC (Jul 11, 2003)
Uncommitted Revolving Credit Facility Agreement - Spansion Japan Ltd. and Bank of Tokyo-Mitsubishi (Nov 28, 2005)
Uncommitted Revolving Credit Facility Agreement - Spansion Japan Ltd. and UFJ Bank Ltd. (Sep 20, 2005)
Waiver of Payment Terms - Fujitsu Microelectronics Ltd. and Spansion Inc. (Jun 30, 2008)